SEDE-2025
34th SEDE Conference: Software & Data Engineering (SEDE)
October 20-21, 2025
Holiday Inn Downtown Superdome, New Orleans, Louisiana, USA
In Conjuction with 38th International Conference on
Computer Applications in Industry and Engineering (CAINE)
Publication and Indexing:
Accepted papers in SEDE-2025 will be published by Springer Nature. Proceedings will be submitted to Web of Science and will be indexed in Scopus, EI Engineering, DBLP, Google Scholar, Conference Proceedings Citation Index (CPCI), ACM Digital Library, IO-Port, MathSciNet and Zentralblatt MATH.The submitted manuscript (no page limit) should closely reflect the final paper as it will appear in the proceedings published by Springer Nature. The formatting templates (LaTex and Word) can be found on Springer Nature’s website at https://www.springer.com/kr/authors-editors/conference-proceedings/conference-proceedings-guidelines.
The submitted manuscripts are peer reviewed (single blind). Each paper will be reviewed by at least two experts in the area. After the conference, you may submit an extended version of your paper for possible publication in the ISCA journal.
Important Dates:
Paper Submission Deadline | May 30, 2025 |
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Notification of Acceptance | July 15, 2025 |
Registration due: | August 15, 2025 |
Camera-Ready Final Manuscript | August 15, 2025 |
Program ChairDr. Venkatasivakumar Margapuri |
Program ChairDr. Noor Amiri |
Program Committee:
Abhay Paroha, Birla Institute of Tech.& Science
Mirsalar Kamari, University of Southern Mississippi
Karan Gupta, SunPower Corporation
Saydul Akbar Murad, University of Southern Mississippi
Takaaki Goto, Toyo University
Tamer Aldwairi, Temple University
Saleh Alnaeli, University of Wisconsin
Maral Azizi, East Carolina University
Silvia Cristea, Anglia Ruskin University
Lei Yang, University of Nevada
Xudong He, Florida International University
Vic Grout, Glyndwr University,
Somenath Chakraborty - West Virginia University
Antoine Bossard - Kanagawa University
Xudong He- Southern Illinois University Carbondale
Bingyang Wei, Texas Christian University
Nic Herndon, East Carolina University
Mejid Memari, Utah Valley University
Ning Yang- Southern Illinois University Carbondale
Chinmay Rajguru, GKN Aerospace
Wei Dai, Purdue University Northwest
Robert Stewart, Kansas State University
Md. Saef Ullah Miah, American International University-Bangladesh